The B760M PROJECT ZERO features a unique back-connect design that reduces the complexity of cable management, resulting in a neater and more aesthetically pleasing appearance for the system. It’s compatible with Intel 14th/13th/12th Processors, supports DDR5, and comes equipped with a 2.5G LAN and Wi-Fi 6E solution. This makes it an excellent choice among mATX motherboards.
AWARDS
ABSOLUTE SIMPLICITY
B760M PROJECT ZERO moves the power connectors, fan connectors, and other pin headers to the back of the motherboard. This provides a cleaner and neater front view, allowing the motherboard, liquid cooler, and graphics card's aesthetic design to be fully displayed.
EXCLUSIVE FEATURE
Pump Fan Support
6 Layer PCB with 2oz Thickened Copper
Back Connect Design
PREMIUM THERMAL SOLUTION
Extended Heatsink
M.2 Shield Frozr
Heatsink with 7W/mK Thermal Pad
HIGH-SPEED TRANSMISSION
2.5G Network Solution
Wi-Fi 6E
Memory Boost
Lightning Gen 5
HARDWARE
PERFORMANCE
Connectivity
We have many partners, working together to cultivate the Back-connect device ecosystem, and we warmly welcome others to join us in strengthening the entire system!
B760M PROJECT ZERO
- Support Intel® Core™ 14th/ 13th/ 12th Gen Processors, Intel® Pentium® Gold and Celeron® Processors for LGA 1700 socket
- Supports DDR5 Memory, up to 7800+(OC) MHz
- Enhanced Power Design: 12+1+1 Duet Rail Power System, dual 8-pin CPU power connectors, Core Boost, Memory Boost
- Lightning Fast Game experience: PCIe 5.0 slot, Lightning Gen 4 x4 M.2, USB 3.2 Gen 2x2
- Premium Thermal Solution: Extended Heatsink Design and M.2 Shield Frozr are built for high performance system and non-stop works
- Audio Boost: Reward your ears with studio grade sound
- High Quality PCB: 6-layer PCB made by 2oz thickened copper and server grade level material